IBM packs wires in vacuum to speed chips and save power
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IBM packs wires in vacuum to speed chips and save power
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Comments (2)
Very well research work. Surely in the future will mix different techniques for obtain best the chips performance..
Posted by Rafael Guevara | January 23, 2008 4:13 PM
Posted on January 23, 2008 16:13
Rather than focusing on improved insulation to over come the capacitance could the chips be designed to use the capacitance? If each layer of the chip was designed for unidirectinoal signal flow would the capacitence amplify rather than impede signal flow?
Posted by Rick Rawson | January 25, 2008 8:49 AM
Posted on January 25, 2008 08:49